The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2022
Filed:
Mar. 08, 2019
Chengdu Eswin Sip Technology Co., Ltd., Chengdu, CN;
Chunbin Zhang, San Jose, CA (US);
Xiaotian Zhou, San Jose, CA (US);
Minghao Shen, San Jose, CA (US);
Yijiang Hu, San Jose, CA (US);
Shaolin Zou, San Jose, CA (US);
CHENGDU ESWIN SIP TECHNOLOGY CO., LTD., Chengdu, CN;
Abstract
Disclosed is an adhesive composition for temporarily bonding a semiconductor workpiece and support carrier pair with improved adhesive film properties. The adhesive composition may include one or more polymer resins, solvents, and a small but critical quantity of surfactants, among others. In operation, the one or more surfactants may improve film continuity, leveling, and reduce voids and defects. Sample semiconductor workpiece includes a semiconductor silicon wafer and sample support carrier includes rigid semiconductor silicon or glass, sapphire or other rigid materials.