For the Inventor, By the Inventor

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Frenchtown, NJ, United States of America

Aries Electronics, Inc.

USPTO Granted Patents = 32

% Expired Patents = 15.6

Trademarks = 7

Forward Citations = 834

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10 inventors (with patents filed for the assignee):

William Y Sinclair (28 out of 28 patents)

James P Walter (2 out of 3 patents)

David J Crimmins (2 out of 2 patents)

4. Joseph Argila (2 out of 2 patents)

5. John T Venaleck (1 out of 52 patents)

6. Edward A Kurz (1 out of 2 patents)

7. Robert J Schaff (1 out of 1 patent)

8. Rocco F Basile (1 out of 1 patent)

9. Edward H Key (1 out of 1 patent)

10. Steven Miller (1 out of 1 patent)

Core Competencies:

Test Probe

Burn-In Socket

Insulation Displacement Terminal

Semiconductor Chip Carrier

Integrated Circuit Probe

Ball Grid Array Socket

Printed Circuit Board

Electrical Connector

Zero Insertion Force

Flat Conductor Cable

DIP Jumpers

Jumper Assembly

32 patents: Sort by Forward Citations

1. 7535241 - Test probe with hollow tubular contact with bullet-nosed configuration at one end and crimped configuration on other end (2009-05-19),

2. 7210951 - Top loaded burn-in socket (2007-05-01),

3. D536666 - Insulation displacement terminal (2007-02-13),

4. 7135764 - Shielded semiconductor chip carrier having a high-density external interface (2006-11-14),

5. 7090522 - Top loaded burn-in socket (2006-08-15),

6. 6937045 - Shielded integrated circuit probe (2005-08-30),

7. 6844749 - Integrated circuit test probe (2005-01-18),

8. 6341962 - Solderless grid array connector (2002-01-29),

9. 6200141 - Land grid array connector (2001-03-13),

10. 6045416 - Universal production ball grid array socket (2000-04-04),

11. 5984694 - Universal production ball grid array socket (1999-11-16),

12. 5887344 - Method of mounting a plurality of ball leads onto a BGA socket (1999-03-30),

13. 5730606 - Universal production ball grid array socket (1998-03-24),

14. 5729147 - Housing for surface mountable device packages (1998-03-17),

15. 5533665 - Method of making a printed circuit board with adaptor pins (1996-07-09),

Company Overview

Aries Electronics, Inc. is a leading provider of advanced interconnect solutions, specializing in the design and manufacture of high-quality connectors and related components. The company focuses on delivering innovative products for various industries, including aerospace, military, and telecommunications. With a commitment to engineering excellence, Aries Electronics leverages cutting-edge technology to meet the evolving needs of its clients, ensuring reliability and performance in critical applications. Headquartered in Frenchtown, NJ, the company serves a global market.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 13 2026

32 Patents

#1 in Frenchtown, NJ

#425 in New Jersey

#10,599 in US

#20,671 in the World

Frenchtown, NJ, United States of America

Aries Electronics, Inc.

Forward Citations = 834

10 inventors:

William Y Sinclair (28 out of 28 patents)

James P Walter (2 out of 3 patents)

David J Crimmins (2 out of 2 patents)

4. Joseph Argila (2 out of 2 patents)

5. John T Venaleck (1 out of 52 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Aries Electronics, Inc.. Retrieved from https://idiyas.com/company/aries-electronics

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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