The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 13, 2001

Filed:

Aug. 12, 1998
Applicant:
Inventor:

William Y. Sinclair, Frenchtown, NJ (US);

Assignee:

Aries Electronics, Inc., Frenchtown, NJ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 1/200 ; H05K 1/00 ;
U.S. Cl.
CPC ...
H01R 1/200 ; H05K 1/00 ;
Abstract

A connector assembly is provided for solderless connection to a land grid array integrated circuit package. In the first embodiment of the invention, a plurality of generally &Sgr;-shaped electrical contacts are disposed in through holes formed in a non-conductive substrate. The electrical contacts are maintained within the through holes due to dimensional differences formed therebetween. In the second embodiment of the invention, a plurality of electrical contacts, each having a pad portion, are disposed in a non-conductive substrate, with the respective pad portions registering with an opening of the through hole. Each electrical contact having a spring arm extending through the non-conductive substrate from the pad portion.


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