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For the Inventor, By the Inventor

TW

Apack Communications Inc.


USPTO Granted Patents = 2

% Expired Patents = 100.0

Forward Citations = 26

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3 inventors (with patents filed for the assignee):

goldMedal Tsung-Ying Hsieh (2 out of 12 patents)

silverMedal Chin-Lien Hsu (2 out of 4 patents)

bronzeMedal Wen-Rui Hsu (2 out of 2 patents)


2 patents:

1. 6495915 - Flip chip package of monolithic microwave integrated circuit (2002-12-17),
2. 6483186 - High power monolithic microwave integrated circuit package (2002-11-19),
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USPTO Data Jan 1 1976 - Sep 29 2026

2 Patents

#126 in

#4,245 in Taiwan

TW
TW

Apack Communications Inc.

Forward Citations = 26

3 inventors:

goldMedal Tsung-Ying Hsieh (2 out of 12 patents)

silverMedal Chin-Lien Hsu (2 out of 4 patents)

bronzeMedal Wen-Rui Hsu (2 out of 2 patents)

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