The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2002
Filed:
Nov. 27, 2001
Applicant:
Inventors:
Assignee:
Apack Communications Inc., Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/310 ; H01L 2/334 ; H01L 2/315 ;
U.S. Cl.
CPC ...
H01L 2/310 ; H01L 2/334 ; H01L 2/315 ;
Abstract
A monolithic microwave integrated circuit (MMIC) package comprises a MMIC die, a heat sink, an insulation substrate, and a sealing material. The MMIC die has an active region and a peripheral region. The heat sink is located in the active region. A plurality of bonding pads are located in the peripheral region. The insulation substrate has an opening and a plurality of transit ports. The opening is used to contain the heat sink and the transit ports are electrically connected to the bonding pads. The sealing material is filled between the insulation substrate and the MMIC die to cover the whole MMIC die so that the MMIC die is fixed to the insulation substrate and is protected.