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Forward Citations = 1

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6 inventors (with patents filed for the assignee):

Shojiro Hanada (2 out of 2 patents)

Shingo Nakamura (2 out of 12 patents)

Takahiro Yada (2 out of 3 patents)

4. Tsukasa Takaiwa (2 out of 2 patents)

5. Masao Hirobe (2 out of 2 patents)

6. Masafumi Suzuhara (1 out of 4 patents)

7 patents: Sort by Forward Citations

1. 12293950 - Semiconductor devices and methods of manufacturing semiconductor devices (2025-05-06),

2. 12183651 - Semiconductor device (2024-12-31),

3. 11967565 - Semiconductor devices including conductive structure and shielding layer and methods of manufacturing semiconductor devices (2024-04-23),

4. 11887915 - Semiconductor device having outer terminal portions with conductive layer on outer end surfaces and a method of manufacturing a semiconductor device (2024-01-30),

5. 11488886 - Semiconductor device (2022-11-01),

6. 11367664 - Semiconductor devices and methods of manufacturing semiconductor devices (2022-06-21),

7. 11362041 - Semiconductor devices including shielding layer and methods of manufacturing semiconductor devices (2022-06-14),

Amkor Technology Japan, Inc. is a leading provider of semiconductor packaging and testing services. With a strong presence in Japan, the company offers a wide range of advanced packaging technologies to support the growing demands of the electronics industry. Amkor's innovative solutions help customers deliver cutting-edge products to market faster and more efficiently.

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Company Badge

USPTO Data Jan 1 1976 - Dec 9 2025

7 Patents

#2 in Oita

#5,301 in Japan

Oita, Japan

Amkor Technology Japan, Inc.