This disclosure relates to a semiconductor package with stacked dies. A first die with a capacitor is spatially separated but electrically connected to a second die with another capacitor. An encapsulant laterally surrounds the second die.

Patent №: 12218105 – Package and method of forming the same. This disclosure relates to a die stack structure where a first and second die are bonded using a hybrid bonding structure. A bonding insulating layer extends to contact an interconnect structure of one die.

Patent №: 12218097 – Bonding to alignment marks with dummy alignment marks. A first package component with alignment and dummy alignment marks is placed, and a second package component with corresponding marks is aligned and bonded. The first alignment mark bonds to the second dummy alignment mark.

Krishna Kiran Mukkavilli

Sr. Director, Engineering at Qualcomm Wireless Research.

Experienced Principal Engineer with a demonstrated history of technical leadership in the wireless industry. Strong professional skilled in cellular technologies including 5G sub-6GHz and mmW, LTE, 3G and broadcast technologies. Systems lead for 5G proto development for world’s leading demos for 5G.

Patent №: 12219566 – Uplink control information multiplexing. A user equipment (UE) generates and transmits an uplink control information (UCI) message with multiplexed bits using orthogonal sequences.

Patent №: 12219493 – SRS antenna switching for multiple receive antennas. A base station determines a user equipment’s (UE) antenna switching capability and schedules sounding reference signal (SRS) resource sets for UEs with more than four receive (RX) antenna ports. The UE transmits SRS resources based on the scheduled sets.

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7 months ago

Angelina Kushnarova

Angelina Kushnarova (Sverediuk) was born in Ukraine. She graduated from Ternopil Medical University with a specialization in Medicine and completed an internship in Radiology at Lviv University. She worked as a Radiologist, while also working as a web developer.