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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12218097 B1

PDFFull Text
Date of Patent:
Feb. 04, 2025

Filed:

Aug. 02, 2023

Bonding to alignment marks with dummy alignment marks

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Hsien-Wei Chen, Hsinchu, TW;

Ying-Ju Chen, Tuku Township, TW;

Ming-Fa Chen, Taichung, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;

Attorney:

Slater Matsil, LLP;

Primary Examiner:

Thanh Y Tran

Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 21/304 (2006.01); H01L 21/683 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 24/80 (2013.01); H01L 21/304 (2013.01); H01L 21/6835 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 23/544 (2013.01); H01L 24/08 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68372 (2013.01); H01L 2223/54426 (2013.01); H01L 2224/0217 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/80006 (2013.01); H01L 2224/80139 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06593 (2013.01);
Abstract

A method includes placing a first package component. The first package component includes a first alignment mark and a first dummy alignment mark. A second package component is aligned to the first package component. The second package component includes a second alignment mark and a second dummy alignment mark. The aligning is performed using the first alignment mark for positioning the first package component, and using the second alignment mark for position the second package component. The second package component is bonded to the first package component to form a package, with the first alignment mark being bonded to the second dummy alignment mark.

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