The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2025
Filed:
Feb. 26, 2024
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2023.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 23/528 (2006.01); H01L 25/00 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 21/56 (2013.01); H01L 23/3128 (2013.01); H01L 23/481 (2013.01); H01L 23/528 (2013.01); H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 24/19 (2013.01); H01L 24/24 (2013.01); H01L 24/89 (2013.01); H01L 25/50 (2013.01); H01L 28/60 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/08146 (2013.01); H01L 2224/24145 (2013.01); H01L 2224/80001 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/06586 (2013.01); H01L 2924/19041 (2013.01);
Abstract
A package includes a first die, a second die, and an encapsulant. The first die includes a first capacitor. The second die includes a second capacitor. The second die is stacked on the first die. The first capacitor is spatially separated from the second capacitor. The first capacitor is electrically connected to the second capacitor. The encapsulant laterally encapsulates the second die.