The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 12, 2018

Filed:

Dec. 08, 2015
Applicant:

Varian Semiconductor Equipment Associates, Inc., Gloucester, MA (US);

Inventors:

Tsung-Liang Chen, Danvers, MA (US);

John Hautala, Beverly, MA (US);

Shurong Liang, Poughkeepsie, NY (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 21/02 (2006.01); C23C 16/513 (2006.01); H01L 21/762 (2006.01); H01L 21/768 (2006.01); C23C 16/04 (2006.01); C23C 16/40 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02274 (2013.01); C23C 16/045 (2013.01); C23C 16/402 (2013.01); C23C 16/513 (2013.01); H01L 21/02164 (2013.01); H01L 21/02211 (2013.01); H01L 21/31116 (2013.01); H01L 21/76224 (2013.01); H01L 21/76831 (2013.01);
Abstract

A method may include generating a plasma in a plasma chamber and directing the ions comprising at least one of a condensing species and inert gas species from the plasma to a cavity within a substrate at a non-zero angle of incidence with respect to a perpendicular to a plane of the substrate. The method may further include; depositing a fill material within the cavity using the condensing species, the depositing taking place concurrently with the directing the ions, wherein the fill material accumulates on a lower surface of the cavity at a first rate, and wherein the fill material accumulates on an upper portion of a sidewall of the cavity at a second rate less than the first rate.


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