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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9991190 B1

PDFFull Text
Date of Patent:
Jun. 05, 2018

Filed:

May. 18, 2012

Packaging with interposer frame

Applicants:

Hui-min Huang, Taoyuan, TW;

Yen-chang HU, Tai-Chung, TW;

Chih-wei Lin, Xinfeng Township, TW;

Ming-da Cheng, Jhubei, TW;

Chung-shi Liu, Hsinchu, TW;

Chen-shien Chen, Zhubei, TW;

Inventors:

Hui-Min Huang, Taoyuan, TW;

Yen-Chang Hu, Tai-Chung, TW;

Chih-Wei Lin, Xinfeng Township, TW;

Ming-Da Cheng, Jhubei, TW;

Chung-Shi Liu, Hsinchu, TW;

Chen-Shien Chen, Zhubei, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;

Attorney:

Hauptman Ham, LLP

Primary Examiner:

Meiya Li

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01); H01L 25/10 (2006.01);
U.S. Cl.
CPC ...
H01L 23/495 (2013.01); H01L 21/568 (2013.01); H01L 23/3107 (2013.01); H01L 23/3121 (2013.01); H01L 23/3128 (2013.01); H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H01L 24/19 (2013.01); H01L 25/105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48257 (2013.01); H01L 2924/181 (2013.01);
Abstract

The mechanisms of using an interposer frame to package a semiconductor die enables fan-out structures and reduces form factor for the packaged semiconductor die. The mechanisms involve using a molding compound to attach the semiconductor die to the interposer frame and forming a redistribution layer on one or both sides of the semiconductor die. The redistribution layer(s) in the package enables fan-out connections and formation of external connection structures. Conductive columns in the interposer frame assist in thermal management.

Find Patent Forward Citations

Huang, Hui-Min. (2018). Packaging with interposer frame (U.S. Patent No. 9991190). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9991190

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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