The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 05, 2018

Filed:

Nov. 03, 2014
Applicant:

Hermes Microvision Inc., Hsinchu, TW;

Inventors:

Yi-Xiang Wang, Fremont, CA (US);

Juying Dou, San Jose, CA (US);

Kenichi Kanai, Palo Alto, CA (US);

Assignee:

HERMES MICROVISION, INC., Hsin-Chu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); B82Y 10/00 (2011.01); B82Y 40/00 (2011.01); H01J 37/20 (2006.01); H01J 37/28 (2006.01); H01J 37/317 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6831 (2013.01); B82Y 10/00 (2013.01); B82Y 40/00 (2013.01); H01J 37/20 (2013.01); H01J 37/28 (2013.01); H01J 37/3174 (2013.01); H01J 2237/0044 (2013.01); H01J 2237/2008 (2013.01);
Abstract

A wafer grounding apparatus and method adaptable to a charged particle beam apparatus is disclosed. A wafer substrate is supported by a wafer mount. A pulse current pin is arranged to be in contact with a backside film formed on a backside of the wafer substrate. A grounding pulse generator provides at least one pulse to drive the pulse current pin such that dielectric breakdown occurring at the backside film leads to establishment of a current path through the backside films. Accordingly, a current flows in the wafer substrate through this current path and then flows out of the wafer substrate via at least one current return path formed from capacitive coupling between the wafer substrate and the wafer mount.


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