The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 29, 2018

Filed:

Feb. 27, 2014
Applicant:

Sixpoint Materials, Inc., Buellton, CA (US);

Inventors:

Edward Letts, Buellton, CA (US);

Tadao Hashimoto, Santa Barbara, CA (US);

Masanori Ikari, Santa Barbara, CA (US);

Assignee:

SixPoint Materials, Inc., Buellton, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/20 (2006.01); C30B 7/10 (2006.01); C30B 29/40 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 29/2003 (2013.01); C30B 7/10 (2013.01); C30B 7/105 (2013.01); C30B 29/403 (2013.01); H01L 21/0254 (2013.01);
Abstract

The present invention discloses methods to create higher quality group III-nitride wafers that then generate improvements in the crystalline properties of ingots produced by ammonothermal growth from an initial defective seed. By obtaining future seeds from carefully chosen regions of an ingot produced on a bowed seed crystal, future ingot crystalline properties can be improved. Specifically the future seeds are optimized if chosen from an area of relieved stress on a cracked ingot or from a carefully chosen N-polar compressed area. When the seeds are sliced out, miscut of 3-10° helps to improve structural quality of successive growth. Additionally a method is proposed to improve crystal quality by using the ammonothermal method to produce a series of ingots, each using a specifically oriented seed from the previous ingot. When employed, these methods enhance the quality of Group III nitride wafers and thus improve the efficiency of any subsequent device.


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