The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2018
Filed:
May. 22, 2017
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Chen-Hua Yu, Hsinchu, TW;
Hsien-Wei Chen, Hsinchu, TW;
An-Jhih Su, Taoyuan, TW;
Chi-Hsi Wu, Hsinchu, TW;
Der-Chyang Yeh, Hsinchu, TW;
Shih-Peng Tai, Xinpu Township, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
Semiconductor device, multi-die packages, and methods of manufacture thereof are described. In an embodiment, a semiconductor device may include: first conductive pillars and second conductive pillars respectively aligned to a first row of first pins and a second row of second pins of a first die, the first pins and the second pins differing in function; a first insulating layer covering surfaces of the first conductive pillars and the second conductive pillars facing away from the first die; first pads disposed on a surface of the first insulating layer facing away from the first die, the first pads substantially aligned to the first conductive pillars; and first traces coupled to the first pads, the first traces extending over a portion of the first insulating layer covering the second conductive pillars.