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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9978607 B1

PDFFull Text
Date of Patent:
May. 22, 2018

Filed:

Sep. 05, 2014

Through via structure and method

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Yung-Chi Lin, Su-Lin, TW;

Hung-Pin Chang, Taipei, TW;

Tsang-Jiuh Wu, Hsin-Chu, TW;

Wen-Chih Chiou, Zhunan Township, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Attorney:

Slater Matsil, LLP

Primary Examiner:

Fernando L Toledo

Assistant Examiner:

Lawrence-Linh T Nguyen

Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/306 (2006.01); H01L 21/308 (2006.01); H01L 27/088 (2006.01); H01L 29/78 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3083 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 29/7833 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A device comprises a via in a substrate comprising a lower via portion with a first width formed of a first conductive material and an upper via portion with a second width greater than the first width, wherein the upper via portion comprises a protection layer formed of the first conductive material and a via fill material portion formed of a second conductive material.

Find Patent Forward Citations

Lin, Yung-Chi. (2018). Through via structure and method (U.S. Patent No. 9978607). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9978607

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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