The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2018
Filed:
Nov. 24, 2016
Infineon Technologies Austria Ag, Villach, AT;
Ralf Otremba, Kaufbeuren, DE;
Teck Sim Lee, Melaka, MY;
Amirul Afiq Hud, Melaka, MY;
Fabian Schnoy, Tegernheim, DE;
Felix Grawert, Villach, AT;
Uwe Kirchner, Feldkirchen, AT;
Bernd Schmoelzer, Radenthein, AT;
Franz Stueckler, St. Stefan, AT;
Infineon Technologies Austria AG, Villach, AT;
Abstract
The semiconductor chip package comprises a semiconductor chip, and an encapsulation body encapsulating the semiconductor chip, wherein the encapsulation body comprises a semiconductor chip; an encapsulation body encapsulating the semiconductor chip, wherein the encapsulation body comprises two opposing main faces and side faces which connect the two main faces with each other, wherein the side face have a smaller surface area than the main faces, respectively, and wherein a marking is provided on at least one of the side faces.