The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 08, 2018

Filed:

Feb. 19, 2016
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Yuichiro Inatomi, Nirasaki, JP;

Takashi Tanaka, Nirasaki, JP;

Nobutaka Mizutani, Nirasaki, JP;

Yusuke Saito, Koshi, JP;

Kazutoshi Iwai, Nirasaki, JP;

Mitsuaki Iwashita, Nirasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/67 (2006.01); C23C 18/18 (2006.01); C23C 18/16 (2006.01); C25D 7/12 (2006.01); C23C 18/38 (2006.01); C23C 18/50 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76874 (2013.01); C23C 18/1651 (2013.01); C23C 18/1653 (2013.01); C23C 18/1696 (2013.01); C23C 18/1889 (2013.01); C23C 18/38 (2013.01); C23C 18/50 (2013.01); C25D 7/12 (2013.01); H01L 21/67028 (2013.01); H01L 21/67051 (2013.01); H01L 21/76843 (2013.01); H01L 21/76898 (2013.01); H01L 21/76873 (2013.01);
Abstract

A catalyst adsorbed on a surface of a substrate is bound to the substrate without leaving residues within a recess of the substrate. A catalyst layer forming method includes forming a catalyst layerby supplying a catalyst solutiononto a substratehaving a recessto adsorb the catalystA onto a surface of the substrate and onto an inner surface of the recess; rinsing the surface of the substrateand an inside of the recessby supplying a rinse liquid; drying the surface of the substrateand the inside of the recess. Further, by supplying a binder solutioncontaining a binderB onto the substrate, the catalystA on the surface of the substrateis bound to the substrateby the binderB.


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