The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 01, 2018

Filed:

Dec. 29, 2014
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Akihito Ohno, Tokyo, JP;

Yoichiro Mitani, Tokyo, JP;

Takahiro Yamamoto, Tokyo, JP;

Nobuyuki Tomita, Tokyo, JP;

Kenichi Hamano, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C30B 25/18 (2006.01); C30B 29/36 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
C30B 25/186 (2013.01); C30B 29/36 (2013.01); H01L 21/0243 (2013.01); H01L 21/0262 (2013.01); H01L 21/02378 (2013.01); H01L 21/02428 (2013.01); H01L 21/02529 (2013.01); H01L 21/02576 (2013.01); H01L 21/02598 (2013.01); H01L 21/02658 (2013.01);
Abstract

A method for manufacturing a silicon carbide semiconductor device includes: preparing a silicon carbide single crystal substrate having a flatness with an average roughness of 0.2 nm or less; gas-etching a surface of the silicon carbide single crystal substrate under an atmosphere of a reducing gas; and forming a silicon carbide layer on the gas-etched surface of the silicon carbide single crystal substrate, wherein an etching rate of the gas etching is made in a range of 0.5 μm/hour or faster to 2.0 μm/hour or slower.


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