The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 17, 2018

Filed:

Sep. 01, 2015
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Chi-Cheng Hung, Tainan, TW;

Kei-Wei Chen, Tainan, TW;

Yu-Sheng Wang, Tainan, TW;

Ming-Ching Chung, Tainan, TW;

Chia-Yang Wu, Tainan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/417 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 21/768 (2006.01); H01L 29/08 (2006.01); H01L 29/165 (2006.01); H01L 21/285 (2006.01); H01L 23/485 (2006.01); H01L 29/49 (2006.01);
U.S. Cl.
CPC ...
H01L 29/41725 (2013.01); H01L 21/28518 (2013.01); H01L 21/76805 (2013.01); H01L 21/76831 (2013.01); H01L 23/485 (2013.01); H01L 29/0847 (2013.01); H01L 29/165 (2013.01); H01L 29/66545 (2013.01); H01L 29/66636 (2013.01); H01L 29/7834 (2013.01); H01L 29/7848 (2013.01); H01L 21/76843 (2013.01); H01L 21/76855 (2013.01); H01L 29/4966 (2013.01);
Abstract

A semiconductor structure includes a semiconductor substrate, at least one dielectric layer, a dielectric spacer liner (DSL) layer, and at least one conductor. The dielectric layer is present on the semiconductor substrate. The dielectric layer has at least one contact hole exposing at least a portion of the semiconductor substrate. The semiconductor substrate has at least one recess communicating with the contact hole. The recess has a bottom surface and at least one sidewall. The DSL layer is present on at least the sidewall of the recess. The conductor is present at least partially in the contact hole and is electrically connected to the semiconductor substrate.


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