The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2018
Filed:
Jul. 06, 2016
Mediatek Inc., Hsin-Chu, TW;
Tzu-Hung Lin, Zhubei, TW;
Chi-Chin Lien, Taipei, TW;
Nai-Wei Liu, Kaohsiung, TW;
I-Hsuan Peng, Hsinchu, TW;
Ching-Wen Hsiao, Hsinchu, TW;
Wei-Che Huang, Zhudong Township, Hsinchu County, TW;
MediaTek Inc., Hsin-Chu, TW;
Abstract
A semiconductor package structure is provided. The semiconductor package structure includes a first semiconductor package that includes a first semiconductor die having a first surface and a second surface opposite thereto. A first package substrate is disposed on the first surface of the first semiconductor die. A first molding compound surrounds the first semiconductor die and the first package substrate. A first redistribution layer (RDL) structure is disposed on the first molding compound, in which the first package substrate is interposed and electrically coupled between the first semiconductor die and the first RDL structure.