Taipei, Taiwan

Chi-Chin Lien

USPTO Granted Patents = 9 


Average Co-Inventor Count = 1.9

ph-index = 1

Forward Citations = 8(Granted Patents)


Company Filing History:


Years Active: 2008-2018

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9 patents (USPTO):Explore Patents

Title: Innovations of Chi-Chin Lien

Introduction

Chi-Chin Lien is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 9 patents. His work primarily focuses on enhancing multimedia data transmission and semiconductor package structures.

Latest Patents

One of his latest patents is a fan-out package structure having an embedded package substrate. This semiconductor package structure includes a first semiconductor package that features a first semiconductor die with a first surface and a second surface opposite to it. A first package substrate is placed on the first surface of the semiconductor die, surrounded by a first molding compound. Additionally, a first redistribution layer (RDL) structure is positioned on the molding compound, with the package substrate interposed and electrically coupled between the semiconductor die and the RDL structure.

Another notable patent involves an apparatus and method for transmitting and receiving multimedia playback enhancement information, VBI data, or auxiliary data through digital transmission means. This data transmission interface apparatus communicates with another interface through digital means for transmitting multimedia data. It includes a processor for processing multimedia data and a data converting circuit that converts multiple first multimedia data sets into second multimedia data sets, along with converting first auxiliary data sets into second auxiliary data sets. The auxiliary data sets include closed caption information.

Career Highlights

Chi-Chin Lien is currently employed at MediaTek Corporation, a leading company in semiconductor technology. His innovative work has positioned him as a key figure in the development of advanced multimedia and semiconductor solutions.

Collaborations

He has collaborated with notable coworkers such as Ting-Hsun Wei and Kuan-Chou Chen, contributing to various projects that enhance the capabilities of multimedia data transmission and semiconductor packaging.

Conclusion

Chi-Chin Lien's contributions to semiconductor technology and multimedia data transmission have made a significant impact in his field. His innovative patents reflect his dedication to advancing technology and improving communication methods.

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