The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2018
Filed:
Dec. 27, 2016
Nxp Usa, Inc., Austin, TX (US);
Lakshminarayan Viswanathan, Phoenix, AZ (US);
Jaynal A. Molla, Gilbert, AZ (US);
Mali Mahalingam, Scottsdale, AZ (US);
Colby Rampley, Phoenix, AZ (US);
NXP USA, INC., Austin, TX (US);
Abstract
An embodiment of a semiconductor die includes a base semiconductor substrate and an electrically conductive through substrate via (TSV) extending between the surfaces of the base semiconductor substrate. The bottom surface of the base semiconductor substrate includes a recessed region proximate to the TSV so that an end of the TSV protrudes from the bottom surface, and so that the TSV sidewall has an exposed portion at the protruding end of the TSV. Back metal, consisting of one or more metallic layers, is deposited on the bottom surface of the base semiconductor substrate and in contact with the TSV. The back metal can include a gold layer, a sintered metallic layer, and/or a plurality of other conductive layers. The die may be attached to a substrate using solder, another sintered metallic layer, or other materials.