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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9927705 B1

PDFFull Text
Date of Patent:
Mar. 27, 2018

Filed:

Jul. 16, 2014

Additive for resist underlayer film-forming composition and resist underlayer film-forming composition containing the same

Applicant:

Nissan Chemical Industries, Ltd., Tokyo, JP;

Inventors:

Noriaki Fujitani, Toyama, JP;

Takafumi Endo, Toyama, JP;

Ryuji Ohnishi, Toyama, JP;

Rikimaru Sakamoto, Toyama, JP;

Assignee:

NISSAN CHEMICAL INDUSTRIES, LTD., Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Martin J Angebranndt

Int. Cl.
CPC ...
G03F 7/11 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); C08F 222/10 (2006.01); G03F 7/32 (2006.01); G03F 7/36 (2006.01); H01L 21/3065 (2006.01); H01L 21/308 (2006.01); H01L 21/027 (2006.01); H01L 21/033 (2006.01);
U.S. Cl.
CPC ...
G03F 7/11 (2013.01); C08F 222/10 (2013.01); G03F 7/168 (2013.01); G03F 7/2053 (2013.01); G03F 7/32 (2013.01); G03F 7/36 (2013.01); H01L 21/3065 (2013.01); H01L 21/3081 (2013.01); H01L 21/3085 (2013.01); H01L 21/3086 (2013.01); H01L 21/3088 (2013.01); H01L 21/0276 (2013.01); H01L 21/0332 (2013.01);
Abstract

An additive for a resist underlayer film-forming composition that modifies a surface state of a resist underlayer film into a hydrophobic state to enhance adhesion between the resist underlayer film and a resist pattern formed on the resist underlayer film, and a resist underlayer film-forming composition containing the additive. An additive for a resist underlayer film-forming composition including a polymer having a structural unit of Formula (1): (wherein R1 is a hydrogen atom or methyl group, L is a single bond or a divalent linking group, and X is an aliphatic hydrocarbon group, an alicyclic hydrocarbon group, or a heterocyclic group having an oxygen atom as a heteroatom that does not have a hydroxy group). A resist underlayer film-forming composition for lithography including a resin binder, an organic solvent, and the additive.

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