The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 20, 2018

Filed:

Sep. 21, 2016
Applicant:

Infineon Technologies Austria Ag, Villach, AT;

Inventors:

Ralf Otremba, Kaufbeuren, DE;

Edward Fuergut, Dasing, DE;

Christian Kasztelan, München, DE;

Hsieh Ting Kuek, Melaka, MY;

Teck Sim Lee, Melaka, MY;

Sanjay Kumar Murugan, Melaka, MY;

Lee Shuang Wang, Melaka, MY;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/36 (2006.01); H01L 23/40 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49568 (2013.01); H01L 21/4825 (2013.01); H01L 21/4882 (2013.01); H01L 21/565 (2013.01); H01L 23/3107 (2013.01); H01L 23/3114 (2013.01); H01L 23/36 (2013.01); H01L 23/4006 (2013.01); H01L 23/4093 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/15159 (2013.01); H01L 2924/181 (2013.01);
Abstract

An electronic component, the electronic component comprising an electrically conductive carrier, an electronic chip on the carrier, an encapsulant encapsulating part of the carrier and the electronic chip, and an electrically insulating and thermally conductive interface structure covering an exposed surface portion of the carrier and a connected surface portion of the encapsulant and being functionalized for promoting heat dissipation via the interface structure on a heat dissipation body.


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