The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2018
Filed:
Mar. 02, 2016
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Chih-Wen Liu, Taoyuan, TW;
Che-Hao Tu, Hsinchu, TW;
Po-Chin Nien, Taipei, TW;
William Weilun Hong, Hsinchu, TW;
Ying-Tsung Chen, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsin-Chu, TW;
Abstract
A method includes measuring a topography of a wafer, determining that a first portion of the wafer has a greater thickness than a specified thickness. The method further includes, after measuring the wafer, performing a Chemical Mechanical Polishing (CMP) process to a first side of the wafer, and during application of the CMP process, applying additional pressure to a region of the wafer, the region comprising an asymmetric part of the wafer, the region including at least a part of the first portion of the wafer.