The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2018
Filed:
Dec. 16, 2011
Osamu Hirakawa, Koshi, JP;
Naoto Yoshitaka, Koshi, JP;
Masaru Honda, Koshi, JP;
Xavier Francois Brun, Chandler, AZ (US);
Charles Wayne Singleton, Jr., Chandler, AZ (US);
Osamu Hirakawa, Koshi, JP;
Naoto Yoshitaka, Koshi, JP;
Masaru Honda, Koshi, JP;
Xavier Francois Brun, Chandler, AZ (US);
Charles Wayne Singleton, Jr., Chandler, AZ (US);
TOKYO ELECTRON LIMITED, Tokyo, JP;
INTEL CORPORATION, Santa Clara, CA (US);
Abstract
A peeling device for peeling off a substrate to be processed and a support substrate from an overlapped substrate, the overlapped substrate being formed by bonding the substrate to be processed and the support substrate by an adhesive, which includes: a first holding unit configured to heat the substrate to be processed and configured to hold the substrate to be processed; a second holding unit configured to heat the support substrate and configured to hold the support substrate; a moving mechanism configured to horizontally move at least one of the first holding unit and the second holding unit relative to each other; and an inert gas supply mechanism configured to supply an inert gas onto a bonding surface of the substrate to be processed or a bonding surface of the support substrate.