The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 13, 2018
Filed:
Oct. 24, 2012
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Yu-Jen Tseng, Hsinchu, TW;
Yen-Liang Lin, Taichung, TW;
Tin-Hao Kuo, Hsinchu, TW;
Chen-Shien Chen, Zhubei, TW;
Mirng-Ji Lii, Sinpu Township, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsin-Chu, TW;
Abstract
A bump-on-trace interconnection structure utilizing a lower volume solder joint for joining a conductive metal pillar and a metal line trace includes a conductive metal pillar having a bonding surface having a width Wand a metal line trace, provided on a package substrate, having a top surface with a width W, where Wis greater than W. The solder joint is bonded to the bonding surface by wetting across the width Wand bonded predominantly only to the top surface of the metal line trace by wetting predominantly only to the top surface across the width W.