The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 06, 2018

Filed:

Nov. 10, 2015
Applicant:

Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;

Inventors:

Chun-Hsiung Lin, Hsinchu County, TW;

Carlos H. Diaz, Mountain View, CA (US);

Hui-Cheng Chang, Tainan, TW;

Syun-Ming Jang, Hsin-Chu, TW;

Mao-Lin Huang, Hsinchu, TW;

Chien-Hsun Wang, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/205 (2006.01); H01L 29/06 (2006.01); H01L 29/78 (2006.01); H01L 29/267 (2006.01); H01L 29/10 (2006.01); H01L 21/762 (2006.01);
U.S. Cl.
CPC ...
H01L 29/205 (2013.01); H01L 29/0649 (2013.01); H01L 29/0653 (2013.01); H01L 29/0657 (2013.01); H01L 29/1054 (2013.01); H01L 29/267 (2013.01); H01L 29/785 (2013.01); H01L 29/7853 (2013.01); H01L 21/76224 (2013.01);
Abstract

According to an exemplary embodiment, a method of forming a fin structure is provided. The method includes the following operations: etching a first dielectric layer to form at least one recess and a first core portion of a fin core; form an oxide layer as a shallow trench isolation layer in the recess; etching back the oxide layer to expose a portion of the fin core; and forming a fin shell to cover a sidewall of the exposed portion of the fin core.


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