The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2018
Filed:
Jun. 16, 2011
Chen-hua Yu, Hsin-Chu, TW;
Lawrence Chiang Sheu, Hsin-Chu, TW;
Hao-yi Tsai, Hsin-Chu, TW;
Chien-hsiun Lee, Hsin-Chu, TW;
Chen-Hua Yu, Hsin-Chu, TW;
Lawrence Chiang Sheu, Hsin-Chu, TW;
Hao-Yi Tsai, Hsin-Chu, TW;
Chien-Hsiun Lee, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
An integrated circuit structure includes a substrate and a metal pad over the substrate. A post-passivation interconnect (PPI) line is connected to the metal pad, wherein the PPI line includes at least a portion over the metal pad. A PPI pad is connected to the PPI line. A polymer layer is over the PPI line and the PPI pad, wherein the polymer layer has a thickness greater than about 30 μm. An under-bump metallurgy (UBM) extends into an opening in the polymer layer and electrically connected to the PPI pad.