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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9902873 B1

PDFFull Text
Date of Patent:
Feb. 27, 2018

Filed:

Dec. 05, 2014

Composition for forming silica based layer, and method for manufacturing silica based layer

Applicant:

Samsung Sdi Co., Ltd., Yongin-si, Gyeonggi-do, KR;

Inventors:

Jin-Hee Bae, Suwon-si, KR;

Taek-Soo Kwak, Suwon-si, KR;

Han-Song Lee, Suwon-si, KR;

Youn-Jin Cho, Suwon-si, KR;

Byeong-Gyu Hwang, Suwon-si, KR;

Bo-Sun Kim, Suwon-si, KR;

Sae-Mi Park, Suwon-si, KR;

Eun-Su Park, Suwon-si, KR;

Jin-Woo Seo, Suwon-si, KR;

Wan-Hee Lim, Suwon-si, KR;

Jun-Young Jang, Suwon-si, KR;

Kwen-Woo Han, Suwon-si, KR;

Assignee:

SAMSUNG SDI CO., LTD., Yongin-Si, Gyeonggi-Do, KR;

Attorney:

Lee & Morse P.C.

Primary Examiner:

Margaret G Moore

Int. Cl.
CPC ...
C08G 77/12 (2006.01); C09D 183/04 (2006.01); C09D 183/16 (2006.01); C09D 183/02 (2006.01); C23C 18/12 (2006.01); H01L 21/02 (2006.01); C08G 77/60 (2006.01); C08G 77/26 (2006.01); C08G 77/54 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
C09D 183/04 (2013.01); C09D 183/02 (2013.01); C09D 183/16 (2013.01); C23C 18/122 (2013.01); C23C 18/1212 (2013.01); C23C 18/1275 (2013.01); C23C 18/1283 (2013.01); H01L 21/02164 (2013.01); H01L 21/02216 (2013.01); H01L 21/02222 (2013.01); H01L 21/02282 (2013.01); H01L 21/02326 (2013.01); H01L 21/02337 (2013.01); C08G 77/12 (2013.01); C08G 77/26 (2013.01); C08G 77/54 (2013.01); C08G 77/60 (2013.01); H01L 28/90 (2013.01);
Abstract

A composition for forming a silica based layer and a method for manufacturing a silica based layer, the composition including a silicon-containing compound, the silicon-containing compound including a hydrogenated polysilazane moiety, a hydrogenated polysiloxazane moiety, or a combination thereof, and a solvent, wherein a number of particles of the silicon-containing compound in the composition and having a particle diameter of about 0.2 μm to about 1 μm is less than or equal to about 10/ml.

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