The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 2018

Filed:

Feb. 29, 2016
Applicant:

Tokyo Electron Limited, Minato-ku, Tokyo, JP;

Inventors:

Steven P. Consiglio, Albany, NY (US);

Robert D. Clark, Livermore, CA (US);

David L. O'Meara, Albany, NY (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/225 (2006.01); H01L 21/02 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/2256 (2013.01); H01L 21/2254 (2013.01); H01L 21/0228 (2013.01); H01L 21/02112 (2013.01); H01L 29/66803 (2013.01);
Abstract

A method is provided for forming an ultra-shallow boron doping region in a semiconductor device. The method includes depositing a diffusion filter layer on a substrate, the diffusion filter containing a boron nitride layer, a boron oxynitride layer, a silicon nitride layer, or a silicon oxynitride layer, and depositing a boron dopant layer on the diffusion filter layer, the boron dopant layer containing boron oxide, boron oxynitride, or a combination thereof, with the proviso that the diffusion filter layer and the boron dopant layer do not contain the same material. The method further includes heat-treating the substrate to form the ultra-shallow boron dopant region in the substrate by controlled diffusion of boron from the boron dopant layer through the diffusion filter layer and into the substrate.


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