The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 06, 2018

Filed:

Nov. 30, 2015
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Kuo-Cheng Ching, Hsinchu County, TW;

Ching-Fang Huang, Taipei, TW;

Carlos H. Diaz, Mountain View, CA (US);

Chih-Hao Wang, Hsinchu, TW;

Wen-Hsing Hsieh, Hsinchu, TW;

Ying-Keung Leung, Hsin-Chu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/423 (2006.01); H01L 29/06 (2006.01); H01L 29/417 (2006.01); H01L 29/78 (2006.01); H01L 21/3205 (2006.01); H01L 21/84 (2006.01);
U.S. Cl.
CPC ...
H01L 29/42392 (2013.01); H01L 21/32053 (2013.01); H01L 21/845 (2013.01); H01L 29/0673 (2013.01); H01L 29/41791 (2013.01); H01L 29/785 (2013.01);
Abstract

A semiconductor device includes a source/drain feature disposed over a substrate. The source/drain feature includes a first nanowire, a second nanowire disposed over the first nanowire, a cladding layer disposed over the first nanowire and the second nanowire and a spacer layer extending from the first nanowire to the second nanowire. The device also includes a conductive feature disposed directly on the source/drain feature such that the conductive feature physically contacts the cladding layer and the spacer layer.


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