The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2018
Filed:
Nov. 02, 2016
Sinmat, Inc., Gainesville, FL (US);
University of Florida Research Foundation, Inc., Gainesville, FL (US);
Rajiv K. Singh, Newberry, FL (US);
Kannan Balasundaram, Gainesville, FL (US);
Arul Chakkaravarthi Arjunan, Gainesville, FL (US);
Deepika Singh, Gainesville, FL (US);
Wei Bai, Gainesville, FL (US);
Sinmat, Inc., Gainesville, FL (US);
University of Florida Research Foundation, Inc., Gainesville, FL (US);
Abstract
A CMP method uses a slurry including colloidal metal oxide or colloidal semiconductor oxide particles (colloidal particles) in water. At least one particle feature is selected from (i) the colloidal particles having a polydispersity >30%, and (ii) mixed particle types including the colloidal particles having an average primary size >50 nm mixed with fumed oxide particles having average primary size <25 nm. A substrate having an alumina surface is placed into a CMP apparatus, and CMP is performed with a rotating polishing pad and the slurry to polish the alumina surface. The polydispersity is determined by a polydispersity formula for a distribution width (w) involving width wand width wat a second larger particle size. The polydispersity formula=(w−w)×100/dav which includes 63% of a total of the colloidal particles by volume and day is an average particle size of the colloidal particles.