The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 2018
Filed:
Aug. 28, 2015
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Edward W. Budiarto, Fremont, CA (US);
Majeed A. Foad, Sunnyvale, CA (US);
Ralf Hofmann, Soquel, CA (US);
Thomas Nowak, Cupertino, CA (US);
Todd Egan, Fremont, CA (US);
Mehdi Vaez-Iravani, Los Gatos, CA (US);
Assignee:
APPLIED MATERIALS, INC., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/67 (2006.01); H01L 21/02 (2006.01); H01L 21/033 (2006.01); H01L 21/285 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67253 (2013.01); H01L 21/02631 (2013.01); H01L 21/0332 (2013.01); H01L 21/0337 (2013.01); H01L 21/2855 (2013.01); H01L 22/12 (2013.01); H01L 22/26 (2013.01);
Abstract
A monitoring and deposition control system and method of operation thereof including: a deposition chamber for depositing a material layer on a substrate; a sensor array for monitoring deposition of the material layer for changes in a layer thickness of the material layer during deposition; and a processing unit for adjusting deposition parameters based on the changes in the layer thickness during deposition.