The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 2018
Filed:
Apr. 17, 2013
Joseph M. Ranish, San Jose, CA (US);
Paul Brillhart, Pleasanton, CA (US);
Jose Antonio Marin, San Jose, CA (US);
Satheesh Kuppurao, San Jose, CA (US);
Balasubramanian Ramachandran, Santa Clara, CA (US);
Swaminathan T. Srinivasan, Pleasanton, CA (US);
Mehmet Tugrul Samir, Mountain View, CA (US);
Joseph M. Ranish, San Jose, CA (US);
Paul Brillhart, Pleasanton, CA (US);
Jose Antonio Marin, San Jose, CA (US);
Satheesh Kuppurao, San Jose, CA (US);
Balasubramanian Ramachandran, Santa Clara, CA (US);
Swaminathan T. Srinivasan, Pleasanton, CA (US);
Mehmet Tugrul Samir, Mountain View, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
Embodiments of the present invention generally relate to chambers and methods of processing substrates therein. The chambers generally include separate process gas and purge gas regions. The process gas region and purge gas region each have a respective gas inlet and gas outlet. The methods generally include positioning a substrate on a substrate support within the chamber. The plane of the substrate support defines the boundary between a process gas region and purge gas region. Purge gas is introduced into the purge gas region through at least one purge gas inlet, and removed from the purge gas region using at least one purge gas outlet. The process gas is introduced into the process gas region through at least one process gas inlet, and removed from the process gas region through at least one process gas outlet. The process gas is thermally decomposed to deposit a material on the substrate.