The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 16, 2018

Filed:

Mar. 07, 2016
Applicant:

Rohm and Haas Electronic Materials Llc, Marlborough, MA (US);

Inventors:

Kevin Rowell, Brighton, MA (US);

Cong Liu, Shrewsbury, MA (US);

Cheng Bai Xu, Southborough, MA (US);

Irvinder Kaur, Northborough, MA (US);

Jong Keun Park, Shrewsbury, MA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/42 (2006.01); H01L 21/027 (2006.01); H01L 21/02 (2006.01); G03F 7/16 (2006.01); G03F 7/36 (2006.01); G03F 7/20 (2006.01);
U.S. Cl.
CPC ...
G03F 7/425 (2013.01); G03F 7/16 (2013.01); G03F 7/2004 (2013.01); G03F 7/36 (2013.01); H01L 21/02057 (2013.01); H01L 21/0274 (2013.01);
Abstract

Methods of trimming a photoresist pattern comprise: (a) providing a semiconductor substrate; (b) forming a photoresist pattern over the semiconductor substrate, wherein the photoresist pattern is formed from a photoresist composition comprising: a first polymer comprising acid labile groups; and a photoacid generator; (c) coating a pattern trimming composition over the photoresist pattern, wherein the pattern trimming composition comprises a second polymer and a solvent system, wherein the solvent system comprises one or more monoether solvents in a combined amount of 50 wt % or more based on the solvent system; (d) heating the coated semiconductor substrate, thereby causing a change in solubility of a surface region of the photoresist pattern in a rinsing agent to be applied; and (e) contacting the photoresist pattern with a rinsing agent to remove the surface region of the photoresist pattern, thereby forming a trimmed photoresist pattern. The methods find particular applicability in the manufacture of semiconductor devices.


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