The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 16, 2018

Filed:

Jun. 20, 2012
Applicants:

David Schaefer, Alameda, CA (US);

Ambarish Chhatre, Santa Clara, CA (US);

Keith William Gaff, Fremont, CA (US);

Sung Lee, Pleasanton, CA (US);

Brooke Mesler Lai, Fremont, CA (US);

Inventors:

David Schaefer, Alameda, CA (US);

Ambarish Chhatre, Santa Clara, CA (US);

Keith William Gaff, Fremont, CA (US);

Sung Lee, Pleasanton, CA (US);

Brooke Mesler Lai, Fremont, CA (US);

Assignee:

LAM RESEARCH CORPORATION, Fremont, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F16J 15/02 (2006.01); H02N 13/00 (2006.01); H01L 21/683 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
F16J 15/021 (2013.01); H01J 37/3255 (2013.01); H01J 37/32495 (2013.01); H01J 37/32568 (2013.01); H01J 37/32715 (2013.01); H01J 37/32724 (2013.01); H01L 21/6831 (2013.01); H01L 21/6833 (2013.01); H01L 21/6838 (2013.01); H02N 13/00 (2013.01); Y10T 29/49908 (2015.01);
Abstract

A lower electrode assembly useful for supporting a semiconductor substrate in a plasma processing chamber includes a temperature controlled lower base plate, an upper plate, a mounting groove surrounding a bond layer and an edge seal comprising an elastomeric band having an outer concave surface in an uncompressed state, the band mounted in the groove such that upper and lower ends of the band are axially compressed and a maximum outward bulging of the band is no greater than a predetermined distance.


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