The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2018
Filed:
May. 05, 2014
Applicant:
Basf SE, Ludwigshafen, DE;
Inventors:
Yongqing Lan, Ludwigshafen, DE;
Peter Przybylski, Ludwigshafen, DE;
Zhenyu Bao, Potsdam, NY (US);
Julian Proelss, Worms, DE;
Assignee:
BASF SE, Ludwigshafen, DE;
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); H01L 21/306 (2006.01); C09K 3/14 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); C09K 3/1436 (2013.01); C09K 3/1463 (2013.01); H01L 21/02024 (2013.01); H01L 21/30612 (2013.01); H01L 21/30625 (2013.01);
Abstract
Described is a chemical-mechanical polishing (CMP) composition comprising the following components: (A) surface modified silica particles having a negative zeta potential of −15 mV or below at a pH in the range of from 2 to 6 (B) one or more polyethylene imines (C) water (D) optionally one or more further constituents, wherein the pH of the composition is in the range of from 2 to 6.