The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 19, 2017
Filed:
Aug. 30, 2013
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Inventors:
Shih Ting Lin, Taipei, TW;
Szu Wei Lu, Hsin-Chu, TW;
Jui-Pin Hung, Hsin-Chu, TW;
Jing-Cheng Lin, Hsin-Chu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/48 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 24/82 (2013.01); H01L 23/481 (2013.01); H01L 24/19 (2013.01); H01L 23/3128 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/97 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1047 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01);
Abstract
Packages, packaging methods, and packaged semiconductor devices are disclosed. In some embodiments, a package for a semiconductor device includes a redistribution layer (RDL) and a plurality of through package vias (TPV's) coupled to the RDL. Each of the plurality of TPV's comprises a first region proximate the RDL and a second region opposite the first region. The first region comprises a first width, and the second region comprises a second width. The second width is greater than the first width.