The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 19, 2017
Filed:
Dec. 10, 2014
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Rajasekaran Swaminathan, Tempe, AZ (US);
Ravindranath V. Mahajan, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/498 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01L 24/13 (2013.01); H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H01L 24/11 (2013.01); H01L 24/742 (2013.01); H01L 24/75 (2013.01); H01L 24/81 (2013.01); H05K 3/3436 (2013.01); H05K 3/3494 (2013.01); H01L 24/16 (2013.01); H01L 2224/1132 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/1148 (2013.01); H01L 2224/11418 (2013.01); H01L 2224/11474 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/131 (2013.01); H01L 2224/133 (2013.01); H01L 2224/13017 (2013.01); H01L 2224/13022 (2013.01); H01L 2224/13023 (2013.01); H01L 2224/1336 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13294 (2013.01); H01L 2224/13311 (2013.01); H01L 2224/13316 (2013.01); H01L 2224/13355 (2013.01); H01L 2224/13357 (2013.01); H01L 2224/13387 (2013.01); H01L 2224/13411 (2013.01); H01L 2224/13447 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/16503 (2013.01); H01L 2224/75264 (2013.01); H01L 2224/8181 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81222 (2013.01); H01L 2224/81409 (2013.01); H01L 2224/81439 (2013.01); H01L 2224/81444 (2013.01); H01L 2224/81455 (2013.01); H01L 2224/81464 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01026 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01322 (2013.01); H05K 3/3484 (2013.01); H05K 2201/0341 (2013.01); H05K 2201/083 (2013.01); H05K 2201/10674 (2013.01); H05K 2203/104 (2013.01); Y02P 70/613 (2015.11);
Abstract
The present disclosure relates to the field of fabricating microelectronic packages, wherein magnetic particles distributed within a solder paste may be used to form a magnetic intermetallic compound interconnect. The intermetallic compound interconnect may be exposed to a magnetic field, which can heat a solder material to a reflow temperature for attachment of microelectronic components comprising the microelectronic packages.