The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2017
Filed:
Feb. 22, 2013
Tokyo Electron Limited, Tokyo, JP;
Nobutaka Mizutani, Nirasaki, JP;
Takashi Tanaka, Nirasaki, JP;
Yuichiro Inatomi, Nirasaki, JP;
Yusuke Saito, Nirasaki, JP;
Mitsuaki Iwashita, Nirasaki, JP;
TOKYO ELECTRON LIMITED, Tokyo, JP;
Abstract
A plating method can improve adhesivity with a substrate. The plating method of performing a plating process on the substrate includes forming a vacuum-deposited layerA on the substrateby performing a vacuum deposition process on the substrate; forming an adhesion layerand a catalyst adsorption layeron the vacuum-deposited layerA of the substrate; and forming a plating layer stacked bodyhaving a first plating layerand a second plating layerwhich function as a barrier film on the catalyst adsorption layerof the substrate. By forming the vacuum-deposited layerA, a surface of the substratecan be smoothened, so that the vacuum-deposited layerA serving as an underlying layer can improve the adhesivity.