The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2017

Filed:

Jun. 11, 2015
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Ki-hyun Park, Yongin-si, KR;

Byoung-ho Kwon, Hwaseong-si, KR;

Dong-chan Kim, Suwon-si, KR;

Choong-seob Shin, Uiwang-si, KR;

Jong-su Kim, Seoul, KR;

Bo-un Yoon, Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 23/544 (2006.01); H01L 21/4757 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); H01L 21/47573 (2013.01); H01L 21/7684 (2013.01); H01L 21/76802 (2013.01); H01L 21/76807 (2013.01); H01L 22/12 (2013.01); H01L 2223/5446 (2013.01); H01L 2223/54426 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A method of manufacturing a semiconductor device includes forming a first alignment mark trench in a first material layer on a substrate. A first alignment mark via may then be formed by etching a second material layer that is underneath the first material layer, where the first alignment mark via is positioned to communicate with the first alignment mark trench. Then, a trench-via-merged-type first alignment mark may be formed by filling the first alignment mark trench and the first alignment mark via with a light reflection material layer.


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