The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2017

Filed:

Jan. 24, 2014
Applicant:

Mpi Corporation, Hsinchu County, TW;

Inventors:

Ming-Chi Chen, Hsinchu County, TW;

Tien-Chia Li, Hsinchu County, TW;

Dai-Jin Yeh, Hsinchu County, TW;

Tsung-Yi Chen, Hsinchu County, TW;

Chien-Kuei Wang, Hsinchu County, TW;

Assignee:

MPI Corporation, Hsinchu County, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/02 (2006.01); G01R 1/073 (2006.01); G01R 1/067 (2006.01);
U.S. Cl.
CPC ...
G01R 1/0735 (2013.01); G01R 1/06733 (2013.01); G01R 1/07314 (2013.01);
Abstract

A wafer testing probe card includes a printed circuit board, a flexible circuit board, an elastic piece, and a probe unit. The flexible circuit board is electrically connected to the printed circuit board. The elastic piece is disposed between the printed circuit board and the flexible circuit board. The probe unit includes a probe head and a plurality of probes. The probe head is fixed on the printed circuit board and has a plurality of through holes. The probes respectively pass through the through holes and move up and down relative to the probe head.


Find Patent Forward Citations

Loading…