The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 07, 2017

Filed:

May. 13, 2016
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Arkadiusz Malinowski, Dresden, DE;

Chung Foong Tan, Dresden, DE;

Nicolas Sassiat, Dresden, DE;

Maciej Wiatr, Dresden, DE;

Assignee:

GLOBALFOUNDRIES Inc., Grand Cayman, KY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 21/306 (2006.01); H01L 29/66 (2006.01); H01L 29/08 (2006.01); H01L 21/3065 (2006.01); H01L 21/02 (2006.01); H01L 29/165 (2006.01); H01L 21/8234 (2006.01); H01L 27/088 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7848 (2013.01); H01L 21/02381 (2013.01); H01L 21/02433 (2013.01); H01L 21/02532 (2013.01); H01L 21/3065 (2013.01); H01L 21/30604 (2013.01); H01L 21/823425 (2013.01); H01L 27/088 (2013.01); H01L 29/0847 (2013.01); H01L 29/165 (2013.01); H01L 29/66636 (2013.01);
Abstract

A method includes providing a semiconductor structure including a substrate, a gate structure over the substrate and a sidewall spacer adjacent the gate structure. The substrate includes a first semiconductor material. A substantially isotropic first etch process removing the first semiconductor material is performed. The first etch process forms an undercut below the sidewall spacer. An anisotropic second etch process removing the first semiconductor material is performed, wherein an etch rate in a thickness direction of the substrate is greater than an etch rate in a horizontal direction that is perpendicular to the thickness direction. A crystallographic third etch process removing the first semiconductor material is performed, wherein an etch rate in a first crystal direction is greater than an etch rate in a second crystal direction. The first, second and third etch processes form a source-side recess and a drain-side recess adjacent the gate structure.


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