The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 07, 2017

Filed:

Dec. 06, 2016
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Burn Jeng Lin, HsinChu, TW;

Shy-Jay Lin, Jhudong Township, TW;

Jaw-Jung Shin, HsinChu, TW;

Wen-Chuan Wang, HsinChu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03B 27/32 (2006.01); G03B 27/44 (2006.01); G03B 27/54 (2006.01); H02K 41/02 (2006.01); G03F 7/20 (2006.01); H01L 21/68 (2006.01);
U.S. Cl.
CPC ...
G03F 7/70275 (2013.01); G03F 7/70008 (2013.01); G03F 7/7015 (2013.01); G03F 7/70208 (2013.01); G03F 7/70358 (2013.01); G03F 7/70716 (2013.01); G03F 7/70725 (2013.01); H01L 21/682 (2013.01);
Abstract

The present disclosure provides a lithography system comprising a radiation source and an exposure tool including a plurality of exposure columns densely packed in a first direction. Each exposure column includes an exposure area configured to pass the radiation source. The system also includes a wafer carrier configured to secure and move one or more wafers along a second direction that is perpendicular to the first direction, so that the one or more wafers are exposed by the exposure tool to form patterns along the second direction. The one or more wafers are covered with resist layer and aligned in the second direction on the wafer carrier.


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