The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 31, 2017

Filed:

Jul. 11, 2016
Applicant:

Phoenix Pioneer Technology Co., Ltd., Hsinchu County, TW;

Inventors:

Shih-Ping Hsu, Hsinchu County, TW;

Che-Wei Hsu, Hsinchu County, TW;

Chin-Ming Liu, Hsinchu County, TW;

Chih-Kuai Yang, Hsinchu County, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H01L 23/13 (2006.01); H01L 23/485 (2006.01); H01L 23/538 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H05K 1/18 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/13 (2013.01); H01L 21/4828 (2013.01); H01L 21/4846 (2013.01); H01L 23/485 (2013.01); H01L 23/49861 (2013.01); H01L 23/5389 (2013.01); H01L 24/24 (2013.01); H01L 24/82 (2013.01); H01L 21/568 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/24175 (2013.01); H05K 1/185 (2013.01); H05K 2201/10674 (2013.01);
Abstract

A substrate structure and a manufacturing method thereof are provided. The substrate structure comprises a dielectric material layer, a conductive wiring layer, a metal core layer, and a conductive pillar layer. The conductive wiring layer is disposed on a surface of the dielectric material layer. The metal core layer having a metal part is disposed inside the dielectric material layer. The conductive pillar layer is disposed inside the dielectric material layer and between the metal core layer and the conductive wiring layer. The metal part has a first side and a second side opposite the first side. One of the first side and the second side is electrically connected to the conductive pillar layer. A width of the first side is different from a width of the second side.


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