The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 31, 2017

Filed:

Feb. 03, 2015
Applicant:

Cabot Microelectronics Corporation, Aurora, IL (US);

Inventors:

Hung-Tsung Huang, Tainan, TW;

Ming-Chih Yeh, Taipei County, TW;

Chih-Pin Tsai, Kaohsiung, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01); H01L 21/461 (2006.01); B44C 1/22 (2006.01); C03C 15/00 (2006.01); C03C 25/68 (2006.01); C25F 3/00 (2006.01); C09K 13/00 (2006.01); C09K 13/04 (2006.01); C09G 1/04 (2006.01); C09G 1/00 (2006.01); H01L 21/321 (2006.01); H01L 21/306 (2006.01); C09G 1/02 (2006.01); H01L 21/304 (2006.01); H01L 21/3105 (2006.01); C09D 1/02 (2006.01); C09K 3/14 (2006.01);
U.S. Cl.
CPC ...
C09G 1/04 (2013.01); C09D 1/02 (2013.01); C09G 1/00 (2013.01); C09G 1/02 (2013.01); H01L 21/304 (2013.01); H01L 21/30625 (2013.01); H01L 21/31053 (2013.01); H01L 21/3212 (2013.01); C09K 3/14 (2013.01);
Abstract

The invention provides a chemical-mechanical polishing composition comprising: (a) colloidal silica particles that are surface modified with metal ions selected from Mg, Ca, Al, B, Be, and combinations thereof, and wherein the colloidal silica particles have a surface hydroxyl group density of from about 1.5 hydroxyls per nmto about 8 hydroxyls per nmof a surface area of the particles, (b) an anionic surfactant, (c) a buffering agent, and (d) water, wherein the polishing composition has a pH of about 2 to about 7, and wherein the polishing composition is substantially free of an oxidizing agent that oxidizes a metal. The invention further provides a method of chemically-mechanically polishing a substrate with the inventive chemical-mechanical polishing composition. Typically, the substrate contains silicon nitride, silicon oxide, and/or polysilicon.


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