The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 24, 2017
Filed:
Jun. 30, 2015
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Yu-Chih Huang, Hsin-Chu, TW;
Yen-Chang Hu, Tai-Chung, TW;
Ching-Wen Hsiao, Hsin-Chu, TW;
Chen-Shien Chen, Zhubei, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A method of forming a die package includes forming a conductive column over a first side of a carrier, attaching a semiconductor die to the first side of the carrier, and forming a molding compound over the first side of the carrier. The semiconductor die and the conductive column are embedded in the molding compound. A second side of the carrier opposite the first side is under a compressive stress. The method also includes forming a first compressive dielectric layer over the semiconductor die, the conductive column, and the molding compound, forming a first redistribution layer (RDL) over the first compressive dielectric layer, and forming a first passivation layer over the first RDL.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile