The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 24, 2017
Filed:
Aug. 16, 2013
Applicant:
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
Inventors:
Chen-Fang Chung, Hsinchu County, TW;
Chih-Tsang Tseng, Hsinchu, TW;
Hsiao-Chuan Lee, Hsinchu County, TW;
Kuo-Pin Chuang, Hsinchu County, TW;
Shuen-Liang Tseng, Hsinchu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/04 (2006.01); H01J 37/34 (2006.01); C23C 14/56 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01J 37/34 (2013.01); C23C 14/564 (2013.01); H01J 37/32477 (2013.01);
Abstract
Systems and methods are provided for material processing. An example apparatus includes a process-kit component containing a first groove and a second groove. The first groove and the second groove are disposed to form a pattern on a surface of the process-kit component. The process-kit component is configured to be placed into a chamber to reduce material deposition on one or more parts of the chamber during material processing.