The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2017
Filed:
Aug. 01, 2016
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Rajasekaran Swaminathan, Tempe, AZ (US);
Leonel R. Arana, Phoenix, AZ (US);
Yoshihiro Tomita, Tsukuba, JP;
Yosuke Kanaoka, Tsukuba, JP;
Assignee:
INTEL CORPORATION, Santa Clara, CA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 25/10 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01L 24/16 (2013.01); H01L 21/4853 (2013.01); H01L 23/3157 (2013.01); H01L 23/49816 (2013.01); H01L 23/49894 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/14 (2013.01); H01L 25/0657 (2013.01); H01L 25/105 (2013.01); H05K 3/3484 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/05571 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/16012 (2013.01); H01L 2224/16147 (2013.01); H01L 2224/16225 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06527 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/181 (2013.01); H05K 3/3452 (2013.01); H05K 2203/043 (2013.01); H05K 2203/083 (2013.01); H05K 2203/1476 (2013.01);
Abstract
Methods of forming a microelectronic packaging structure are described. Those methods may include forming a solder paste comprising a sacrificial polymer on a substrate, curing the solder paste below a reflow temperature of the solder to form a solid composite hybrid bump on the conductive pads, forming a molding compound around the solid composite hybrid bump, and reflowing the hybrid bump, wherein the sacrificial polymer is substantially decomposed.